BERGQUIST GAP FILLER TGF 4000 is a 4.0 W/m·K thermally conductive, ultra-conforming,silicone-based, two-part liquid gap filler designed for high-efficiency thermal management.
Thermal conductivity of 4.0 W/m·K for enhanced heat dissipation
Ultra-conforming silicone formulation for effective interface contact
Extended working time supports greater manufacturing flexibility
Low natural tack ideal for applications where strong structural bonding is not required
Cures at room temperature, with the option to accelerate the process using heat